Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-12-28
1997-07-08
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 522, 257668, 257675, 361719, H05K 720
Patent
active
056468318
ABSTRACT:
A quad flat pack arrangement which provides for an electrically enhanced integrated-circuit package structure is disclosed. An integrated-circuit die is centrally attached to the top surface of a thermally-conductive, and electrically conductive or insulated substrate. A lead frame having a plurality of inwardly-extending bonding fingers has the bottom sides thereof attached to the top surface of the substrate by a non-conductive adhesive so that an open portion thereof overlies the integrated-circuit die. The plurality of bonding fingers are disposed so as to peripherally surround the integrated-circuit die. A double-sided printed circuit board having first and second conductive layers disposed on its opposite sides is disposed over and bonded to the lead frame. Bonding wires are used to interconnect bonding pads on the integrated-circuit die to the first and second conductive layers. A plastic material is molded around the substrate, die, lead frame, printed circuit board and conductive layers.
REFERENCES:
patent: 5155299 (1992-10-01), Mahulikar
patent: 5379187 (1995-01-01), Lee
patent: 5394298 (1995-02-01), Sagisaka
patent: 5438478 (1995-08-01), Kondo
patent: 5552631 (1996-09-01), McCormick
patent: 5578796 (1996-11-01), Bhatt
King Patrick T.
Tolin Gerald P.
VLSI Technology Inc.
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