Electrically disbondable compositions and related methods

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Reexamination Certificate

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C428S3550RA, C428S447000, C429S212000, C429S218100, C252S500000

Reexamination Certificate

active

07465492

ABSTRACT:
Compositions capable of rapidly curing to a strong substrate bond are removable from a surface to which the composition is bonded without damage to the underlying substrates. The compositions of the present invention may be used in both temporary and permanent bonding and coating applications.

REFERENCES:
patent: 3679534 (1972-07-01), Weinberg
patent: 4171240 (1979-10-01), Wong
patent: 4729797 (1988-03-01), Linde et al.
patent: 4882399 (1989-11-01), Tesoro et al.
patent: 5100494 (1992-03-01), Schmidt
patent: 5219679 (1993-06-01), Abraham et al.
patent: 5252413 (1993-10-01), Alamgir et al.
patent: 5441830 (1995-08-01), Moulton et al.
patent: 5512613 (1996-04-01), Afzali-Ardakani et al.
patent: 5560934 (1996-10-01), Afzali-Ardakani et al.
patent: 5565284 (1996-10-01), Koga
patent: 5760337 (1998-06-01), Iyer et al.
patent: 6620308 (2003-09-01), Gilbert
patent: 672 094 (1995-09-01), None
patent: 848 445 (1998-06-01), None
patent: 852 406 (1998-07-01), None
patent: 862 236 (1998-09-01), None
patent: 11-134275 (2000-11-01), None
patent: 2000-319599 (2000-11-01), None
Gilbert, Michael D., “Cleavable Thermosetting Epoxies: A Tool for Monitoring Cure Chemistry Perturbation at an Interface,” Mat. Res. Soc. Symp. Proc. vol. 304, 1993, 49-52.
Newman, John S., Introduction, Electrochemical Systems, Second Edition, 1991, 1-2 and 16-18.
Yang, Shu et al., Reworkable Epoxies: Thermosets with Thermally Cleavable Groups for Controlled Network Breakdown, Chem. Mater. 1998, 10, 1475-1482.
Ogino, Kenji et al., “Synthesis and Characterization of Thermally Degradable Polymer Networks,” Chem. Mater. 1998, 10, 3833-3838.
U.S. Appl. No. 09/352,976, Gilbert, filed Jul. 14, 1999.

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