Electrically connecting substrate with electrical device

Details Electrically connecting substrate with electrical device Electrically connecting substrate with electrical device

2008-09-19

2009-08-18

Thai, Luan C (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S786000, C438S617000, C228S180500, C228S001100, C228S110100

Reexamination Certificate

active

07576439

ABSTRACT:
A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.

REFERENCES:
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patent: 2002/0137327 (2002-09-01), Arakawa
patent: 2003/0102358 (2003-06-01), Bowen
patent: 199 00 165 (1999-07-01), None
patent: 1 422 014 (2004-05-01), None
Beni Nachon “The Basics of Ball Bonding”, K&S Technical Article, www.kns.com, copyright 2004.

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