Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Patent
1985-07-22
1987-06-02
Schofer, Joseph L.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Including a second component containing structurally defined...
428414, 428415, 428416, B32B 2738
Patent
active
046703390
ABSTRACT:
The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds between two substrates. Copper microspheres, having an average diameter of about 2 microns are bound in an epoxy layer which bonds two substrates together. The microspheres make electrical contact between the substrates while providing intersphere gaps which are filled with the epoxy which actually bonds the substrates together.
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Advanced Technology Laboratories, Inc.
Asman Sanford J.
Levinson Lawrence S.
Sarofim N.
Schofer Joseph L.
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