Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-09-26
1998-07-21
Ostrowsi, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257719, 257720, 257746, 257747, 361708, 361712, 16510417, 165185, H01L 2334
Patent
active
057838623
ABSTRACT:
A thermal interface 26 between a heat source (e.g., an IC die) 24 and a heat sink 28 comprises a metallic mesh (26a) filled with a thermally conductive semi-liquid substance (26b). The thermally conductive semi-liquid substance may comprise, e.g., silicone grease or paraffin. The wire mesh may comprise silver, copper and/or gold cloth.
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Hewlett-Packard Co.
Neudeck Alexander J.
Ostrowsi David
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