Electrically conductive substrate with high heat conductivity

Details Electrically conductive substrate with high heat conductivity Electrically conductive substrate with high heat conductivity

2007-04-11

2010-02-02

Lam, Cathy (Department: 1794)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C174S255000, C174S257000, C174S258000, C174S264000, C428S901000

Reexamination Certificate

active

07655292

ABSTRACT:
An electrically conductive substrate with a high heat conductivity has an aluminum plate having multiple holes. An isolation layer is formed on the aluminum plate and inner walls of the holes. Multiple electrically conductive materials are inserted in the holes. A circuit layer is formed on the aluminum plate, electrically connects to the electrically conductive materials and has a rough surface. A graphite layer is formed on the rough surface of the circuit layer. The electric components are respectively provided on the holes, and the heat generated by the electric components is dissipated effectively by the aluminum plate.

REFERENCES:
patent: 4601916 (1986-07-01), Arachtingi
patent: 4732636 (1988-03-01), Varker
patent: 4769270 (1988-09-01), Nagamatsu et al.
patent: 6159586 (2000-12-01), Inoue et al.
patent: 6373000 (2002-04-01), Nakamura et al.
patent: 7112285 (2006-09-01), Chakravorty

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