Electrically conductive silicone elastomer compositions, methods

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

524588, 524780, 524847, 524860, 522 99, 528 15, C08L 8304

Patent

active

058721703

ABSTRACT:
A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group-containing organopolysiloxane such that when the composition is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the composition, both before and during the hydrosilyation reaction, is minimized.
A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.
A semiconductor device manufactured by this method which has improved reliability.

REFERENCES:
patent: 5173765 (1992-12-01), Nakayoshi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrically conductive silicone elastomer compositions, methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrically conductive silicone elastomer compositions, methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically conductive silicone elastomer compositions, methods will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2062926

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.