Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Patent
1997-04-21
1999-02-16
Nakarani, D. S.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
524588, 524780, 524847, 524860, 522 99, 528 15, C08L 8304
Patent
active
058721703
ABSTRACT:
A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group-containing organopolysiloxane such that when the composition is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the composition, both before and during the hydrosilyation reaction, is minimized.
A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.
A semiconductor device manufactured by this method which has improved reliability.
REFERENCES:
patent: 5173765 (1992-12-01), Nakayoshi et al.
Mine Katsutoshi
Mitani Osamu
Nakayoshi Kazumi
Tazawa Rikako
Down Corning Toray Silicone Co., Ltd.
Milco Larry A.
Nakarani D. S.
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