Electrically conductive silicone elastomer compositions, methods

Details Electrically conductive silicone elastomer compositions, methods Electrically conductive silicone elastomer compositions, methods

1999-01-15

2000-03-21

Dawson, Robert

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156329, 361820, 522 99, 524440, 524588, 524780, 524847, 524860, 528 15, B32B 3128

Patent

active

060398310

ABSTRACT:
A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group containing organopolysiloxane such that when the compositon is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the compositon, both before and during the hydrosilyation reaction, is minimized.
A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.
A semiconductor device manufactured by this method which has improved reliability.

REFERENCES:
patent: 5173765 (1992-12-01), Nakayoshi et al.

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