Electrically-conductive resin compositions and moldings

Details Electrically-conductive resin compositions and moldings Electrically-conductive resin compositions and moldings

2004-10-12

2008-03-04

McGinty, Douglas (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Metal compound containing

C528S354000, C252S500000

Reexamination Certificate

active

07338623

ABSTRACT:
An electrically-conductive resin composition comprises (A) a thermoplastic resin and (B) an electrically-conductive polymer blended together. The electrically-conductive polymer is an electrically-conductive polyester doped with a dissociable inorganic salt. The doped polyester is at least one polyester selected from the group consisting of (a) polyesters each of which has a weight average molecular weight of from 50,000 to 500,000 and has been obtained by subjecting at least caprolactone as a monomer to ring-opening polymerization and (b) comb polyesters each of which has one or more polyester chains each having a weight average molecular weight of from 50,000 to 200,000 and has been obtained by subjecting a lactone to ring-opening polymerization in the presence of a trifunctional or higher functional, polyhydric alcohol as a polymerization initiator. Electrically-conductive resin moldings made of such electrically-conductive resin compositions are also disclosed.

REFERENCES:
patent: 5863466 (1999-01-01), Mor
patent: 6621684 (2003-09-01), Shimamoto et al.
patent: 61-85460 (1986-05-01), None
patent: 2001-316593 (2001-11-01), None
patent: 2002-179898 (2002-06-01), None

Affiliated with

Also associated with

Rating

Electrically-conductive resin compositions and moldings does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrically-conductive resin compositions and moldings, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically-conductive resin compositions and moldings will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3961003