Electrically conductive pressure sensitive adhesives

Details Electrically conductive pressure sensitive adhesives Electrically conductive pressure sensitive adhesives

1995-01-19

1997-07-08

McGinty, Douglas J.

Compositions

Electrically conductive or emissive compositions

528210, 528422, H01B 100, H01B 120, H01B 124

Patent

active

056457642

ABSTRACT:
An electrically conductive pressure sensitive adhesive containing electrically conductive polymers used as an alternative to metallic solder in interconnect electronic applications.

REFERENCES:
patent: 4830776 (1989-05-01), Thompson
patent: 5061294 (1991-10-01), Harmer et al.
patent: 5264552 (1993-11-01), Abe et al.
patent: 5378403 (1995-01-01), Shacklette

Affiliated with

Also associated with

Rating

Electrically conductive pressure sensitive adhesives does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrically conductive pressure sensitive adhesives, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically conductive pressure sensitive adhesives will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2407361