Electrically conductive paste

Details Electrically conductive paste Electrically conductive paste

1996-01-18

1997-04-08

Lieberman, Paul

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 427216, 427220, 106 113, 428357, 428922, H01B 102, B32B 1504

Patent

active

056184700

ABSTRACT:
An electrically conductive paste effectively protects copper powder from oxidation and provides good solderability and terminal strength. It is composed of a copper powder, a glass frit in an amount of 2-20 wt % of the copper powder, an organic vehicle in an amount of 10-30 wt % of the solid component (the copper powder and glass frit), and a solution of a borate ester having a high boiling point, a solution of boric acid, a solution of an organic salt of boron, and a solution of a borate ester having a low boiling point in an alcohol having a high boiling point, the amount of the solution being 0.01 to 0.5 wt % in terms of boron and based on the copper powder.

REFERENCES:
patent: 5332596 (1994-07-01), Tani et al.
patent: 5344503 (1994-09-01), Watanabe et al.

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