Electrically conductive interposer and array package concept for

Details Electrically conductive interposer and array package concept for Electrically conductive interposer and array package concept for

1992-12-02

1994-06-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361749, 361760, 361807, 174255, 257678, 439 91, H05K 712

Patent

active

053215834

ABSTRACT:
An electronic assembly that includes an electronic package which is coupled to a circuit board by a plurality of metal spheres that are captured by an interposer. The metal spheres electrically couple a plurality of first conductive pads on the electronic package with a plurality of second conductive pads on the circuit board. The spheres are pressed into operative contact with the conductive pads by a clamp adapted to apply a pressure to the electronic package. The metal spheres are captured by the interposer so that the spheres can rotate relative to the electronic package and the circuit board. The rotating spheres function as bearings which allow the interposer and package to be removed from the clamp and board without detaching the clamp. The electronic package can be coupled to the circuit board by merely pushing the package and interposer between the clamp and board until the metal spheres are properly aligned with the conductive pads.

REFERENCES:
patent: 3634807 (1972-01-01), Grobe
patent: 5159535 (1992-10-01), Desai et al.

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