Electrically conductive interconnection through a body of semico

Fishing – trapping – and vermin destroying

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437143, 437199, 437160, 437974, H01L 21324, H01L 21477

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054478715

ABSTRACT:
Methods and structures of an etched-back thermomigrated interconnection which provides means for electrically connecting coplanar surfaces of a body of semiconductor material while concurrently providing means of making mechanical, electrical, and thermal external connections to the body of semiconductor material.

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patent: 4773972 (1988-09-01), Mikkor
Cline et al, J. of Applied Physics vol. 47 #6 Jun. 1976 2316-2324 and 2332-2336.
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Anthony et al J. of Applied Physics vol. 49 #12 Dec. 1978 5774-5782.
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IEEE Trans. on Electron Devices, vol., ED-26, No. 12, Dec. 1979 by Ching-Chang When, T. C. Chen, and Jay N. Zemel entitled "Gate Controlled Diodes for Ionic Concentration Measurements".

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