Fishing – trapping – and vermin destroying
Patent
1993-03-05
1995-09-05
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437143, 437199, 437160, 437974, H01L 21324, H01L 21477
Patent
active
054478715
ABSTRACT:
Methods and structures of an etched-back thermomigrated interconnection which provides means for electrically connecting coplanar surfaces of a body of semiconductor material while concurrently providing means of making mechanical, electrical, and thermal external connections to the body of semiconductor material.
REFERENCES:
patent: 3979820 (1976-09-01), Anthony
patent: 4239312 (1980-12-01), Myer et al.
patent: 4275410 (1981-06-01), Grinberg et al.
patent: 4290830 (1981-09-01), Mochizuki et al.
patent: 4370179 (1983-01-01), Roger
patent: 4519850 (1985-05-01), Kluge-Weiss
patent: 4720308 (1988-01-01), Anthony et al.
patent: 4761681 (1988-08-01), Reid
patent: 4773972 (1988-09-01), Mikkor
Cline et al, J. of Applied Physics vol. 47 #6 Jun. 1976 2316-2324 and 2332-2336.
Anthony et al J. of Applied Physics vol. 48 #9 Sep. 1976 3943-3949.
Cline et al J. of Applied Physics vol. 49 #4 Apr. 1978 2412-2419.
Cline et al J. of Applied Physics vol. 49 #5 May 1978 2777-2786.
Anthony et al J. of Applied Physics vol. 49 #12 Dec. 1978 5774-5782.
Journal of Applied Physics, vol. 47, No. 6 pp. 2325-2331, Feb. 1976 by H. E. Cline and T. R. Anthony entitled "High Speed Droplet Migration in Silicon".
IEEE Trans. on Electron Devices, vol., ED-26, No. 12, Dec. 1979 by Ching-Chang When, T. C. Chen, and Jay N. Zemel entitled "Gate Controlled Diodes for Ionic Concentration Measurements".
Gurley Lynne A.
Hearn Brian E.
Tam Kam T.
LandOfFree
Electrically conductive interconnection through a body of semico does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrically conductive interconnection through a body of semico, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically conductive interconnection through a body of semico will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-472387