Electrically conductive interconnection through a body of semico

Details Electrically conductive interconnection through a body of semico Electrically conductive interconnection through a body of semico

1994-12-13

1996-06-18

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257621, 257774, 257775, H01L 21324, H01L 21477

Patent

active

055280803

ABSTRACT:
Conductive feed-throughs formed by partially migrating conductive material in a body of semiconductor material are used to provide electrical interconnections between the semiconductor surfaces. In addition, the conductive feed-throughs furnish mechanical support and thermal dissipation paths for the body of semiconductor material.

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IEEE Transactions of Election Devices, vol. ED-25, No. 12, pp. 1945-1951, Dec. 1979, "Gate-Controlled Diodes for Ionic Concentration Measurement".

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