Electrically conductive feedthrough connection and methods of ma

Details Electrically conductive feedthrough connection and methods of ma Electrically conductive feedthrough connection and methods of ma

1990-03-20

1993-03-16

Picard, Leo P.

Electricity: conductors and insulators

Insulators

Through wall or plate

174 5056, 174152GM, 174 5061, 174 5062, H01B 1726

Patent

active

051946971

ABSTRACT:
A mechanically heavily loadable and high-vacuum-tight feedthrough connection through a hole (2) of a high-temperature-resistant and vacuum-proof insulating part (1), particularly of ceramic, glass, or a single crystal, is disclosed which can be produced in a single high-temperature step and is thus inexpensive. It is designed as a terminal lead (4) covered with active solder and soldered into the hole, the terminal lead having a coefficient of thermal expansion less than that of the insulating part (1). The feedthrough connection is preferably used in a capacitive pressure sensor (10) having a diaphragm (11) and a substrate (12) which have spaced-apart, flat inner surfaces which are provided with at least one conductive layer (14, 15) for forming at least one capacitor and are electrically connected to the respective rear side via the feedthrough connection.

REFERENCES:
patent: 2121590 (1938-06-01), Espe
patent: 3436109 (1969-04-01), Loose
patent: 3858097 (1974-12-01), Polye
patent: 3901772 (1975-08-01), Guillotin et al.
patent: 4345299 (1982-08-01), Ho
patent: 4371588 (1983-02-01), Kyle
"Vakuumichte Metall-Keramik-Verbindungen", pp. 69-71 ETZ-B, a German periodical, Mar. 21, 1958, Von Korlernst Muller.

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