Electrically conductive copper layers and process for preparing

Stock material or miscellaneous articles – Structurally defined web or sheet – Including components having same physical characteristic in...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428336, 428472, 428469, 204 15, B32B 1504, B32B 1520, C25D 502

Patent

active

049903950

ABSTRACT:
Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areas

REFERENCES:
patent: 2844530 (1957-02-01), Wesley et al.
patent: 3981691 (1976-09-01), Cuneo
patent: 4055707 (1977-10-01), McDonald
patent: 4119761 (1978-10-01), Kuze et al.
patent: 4350574 (1982-09-01), McDonald
patent: 4727014 (1988-02-01), Horn et al.
patent: 4750976 (1988-06-01), Hupe et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrically conductive copper layers and process for preparing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrically conductive copper layers and process for preparing , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically conductive copper layers and process for preparing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-9819

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.