Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1991-07-09
1993-09-28
Bell, Mark L.
Compositions
Electrically conductive or emissive compositions
Free metal containing
252514, 524439, 524440, H01B 106
Patent
active
052484513
ABSTRACT:
The present invention provides a conductive copper composition comprising metal powder, a binder, a dispersant, and a solvent, characterized by containing 100 parts by weight of copper powder in the form of spherical or granule particles coated with silver as the metal powder, 6 to 18 parts by weight of resol resin satisfying the following conditions (a) to (c) as the binder, 0.05 to 1 part by weight of the dispersant, and 2 to 15 parts of the solvent:
REFERENCES:
patent: 5045236 (1991-09-01), Tsunaga et al.
English language abstract of Japanese Patent No. 64-34597 Feb. 6, 1989.
Gokan Kyoichi
Hirosawa Masaki
Kurimoto Yoshiaki
Suzuki Takao
Tsunaga Masayuki
Bell Mark L.
Gunei Chemical Industry Co., Ltd.
Marcantoni Paul
Mitsui Mining & Smelting Co. Ltd.
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