Electrically conductive composition for via-holes

Details Electrically conductive composition for via-holes Electrically conductive composition for via-holes

2007-04-26

2010-06-15

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S513000, C361S748000, C427S097700

Reexamination Certificate

active

07736544

ABSTRACT:
The present invention relates to an electrically conductive composition for filling via-holes formed in an electronic circuit substrate containing an electrically conductive metal and a vehicle, wherein the content of the electrically conductive metal is 57 vol % or more, and the composition is a plastic fluid for which fluidity increases when external pressure is applied to the composition.

REFERENCES:
patent: 4381945 (1983-05-01), Nair
patent: 5029242 (1991-07-01), Sammet
patent: 5283104 (1994-02-01), Aoude et al.
patent: 6096411 (2000-08-01), Nakatani et al.
patent: 6139777 (2000-10-01), Omoya et al.
patent: 6337037 (2002-01-01), St. John
patent: 6406774 (2002-06-01), Banba et al.
patent: 2002/0050586 (2002-05-01), Oshita et al.
patent: 2004/0013860 (2004-01-01), Sumi et al.
patent: 2006/0248383 (2006-11-01), Urakawa
patent: 2007/0080329 (2007-04-01), Nomiya et al.
patent: 2007/0235694 (2007-10-01), Nair et al.
patent: 1717855 (2006-11-01), None
patent: 2003-324268 (2003-11-01), None

Affiliated with

Also associated with

Rating

Electrically conductive composition for via-holes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrically conductive composition for via-holes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically conductive composition for via-holes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4245899