Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1991-11-07
1994-01-11
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156235, 156249, 156344, B32B 3100
Patent
active
052777340
ABSTRACT:
A method and an apparatus for making a conductive circuit in sheet form. A circuit trace is firstly designed using a CAD (computer aided design) system and a computer aided cutting device is operated by the CAD to cut the desired circuit trace in a thin foil sheet which is adhesively secured to a release backing sheet. The non-circuit trace portions of the foil sheet are removed from the adhesive release backing sheet leaving only the circuit trace. An adhesive transfer sheet is then used to remove the actual circuit trace, in an undisturbed manner, from the release sheet and applied it to a support base. Because the circuit trace has an adhesive backing, it will adhere to the support base. A multi-layer flexible electric conductive circuit can also be fabricated with this method and the transfer sheet can also be utilized as an insulating layer.
REFERENCES:
patent: 3279969 (1966-10-01), Borchardt
patent: 4717438 (1988-01-01), Benge et al.
patent: 4869767 (1989-09-01), Robinson et al.
patent: 5017257 (1991-05-01), Murphy
Engel, Jr. James J.
Fred Bayer Holdings Inc.
Simmons David A.
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