Electrically conductive bonding films

Details Electrically conductive bonding films Electrically conductive bonding films

1995-06-07

1997-09-16

Ryan, Patrick

Stock material or miscellaneous articles

Composite

Of polyimide

428323, 428328, 428209, 428901, 428458, 252512, 525928, 528351, 528353, 1563066, 156327, B32B 2718, C09J 700

Patent

active

056678991

ABSTRACT:
An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

REFERENCES:
patent: 4012555 (1977-03-01), Keske
patent: 4064289 (1977-12-01), Yokoyama et al.
patent: 4557860 (1985-12-01), DiSalvo et al.
patent: 4681928 (1987-07-01), Berger et al.
patent: 4692272 (1987-09-01), Goswami et al.
patent: 4714726 (1987-12-01), Ketley
patent: 4959008 (1990-09-01), Wasulko
patent: 5115089 (1992-05-01), Yoshida et al.
patent: 5204399 (1993-04-01), Edelman
"Die Bonding Film Adhesive Simplifies Automation" by William M. Wasulko, et al., reported in Microelectronic Manufacturing and Testing, Oct., 1985, published by Lake Publishing Corporation, in U.S.A. (English reference).

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