Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating
Reexamination Certificate
2005-12-30
2009-06-02
Wong, Edna (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly alloy coating
C205S157000, C205S191000, C205S192000, C205S238000, C205S305000
Reexamination Certificate
active
07540950
ABSTRACT:
An electrically conductive body, which in particular includes a metal and/or an alloy and/or a semiconductor, includes an adhesion promoter layer provided on at least one surface of the electrically conductive body. The adhesion promoter layer includes a metal, in particular zinc, and a porous, in particular platelike and/or needle-shaped and/or sponge-like, surface structure.
REFERENCES:
patent: 3672996 (1972-06-01), Louzos
patent: 4668471 (1987-05-01), Futatsuka et al.
patent: 5098796 (1992-03-01), Lin et al.
patent: 5183552 (1993-02-01), Bressel et al.
patent: 5209987 (1993-05-01), Penneck et al.
patent: 5343073 (1994-08-01), Parthasarathi et al.
patent: 5626736 (1997-05-01), Florio et al.
patent: 5693209 (1997-12-01), Bressel et al.
patent: 5830975 (1998-11-01), Perrauld et al.
patent: 5955936 (1999-09-01), Shaw, Jr. et al.
patent: 6169246 (2001-01-01), Wu et al.
patent: 6878486 (2005-04-01), Schubert et al.
patent: 2003/0118861 (2003-06-01), Heimann et al.
patent: 197 31 424 (1998-08-01), None
patent: 2 070 947 (1991-11-01), None
Riedl Edmund
Schober Wolfgang
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Wong Edna
LandOfFree
Electrically conductive body including an adhesion promoter... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrically conductive body including an adhesion promoter..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically conductive body including an adhesion promoter... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4074104