Electrically conductive alloy

Metal fusion bonding – Process – Plural joints

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Details

228263, 428606, H01L 2160

Patent

active

040699633

ABSTRACT:
An alloy comprising silver plus one or more additives taken from the class consisting of gold, platinum, osmium, iridium, palladium, ruthenium and rhodium is disclosed. Each additive metal is present in an amount of from 0 to 1% by weight of the alloy. The total amount of additive is at least 0.05% by weight of the alloy. A method of making permanent electrical connections using the alloy is also disclosed.

REFERENCES:
patent: 1970084 (1934-08-01), Feussner
patent: 3310718 (1967-03-01), Lupfer

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