Electrically conductive adhesives

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component

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4283173, 4283175, 4283177, 428343, 428344, 428354, B32B 326, B32B 712

Patent

active

056040261

ABSTRACT:
An electrically conductive adhesive is described that is made of a porous substrate having numerous passages extending through it. The walls of the substrate defining the passages are plated with a conductive metal. This provides a continuous plating from one side of the porous substrate to the other. The remaining passage volume is substantially filled with an adhesive resin. The adhesive can be used to electrically connect two metal surfaces.

REFERENCES:
patent: 3953566 (1976-04-01), Gore
patent: 4385102 (1983-05-01), Fitzky et al.
patent: 4557957 (1985-12-01), Manniso
patent: 4857668 (1989-08-01), Buonanno
patent: 4912594 (1990-03-01), Bannink, Jr. et al.
patent: 5202536 (1993-04-01), Buonnano
patent: 5269810 (1993-12-01), Hull
Patent Abstracts of Japan vol. 017, No. 009 (E-1303) 8 Jan. 1993 & JP, A, 04 242 010 (Sony Chem Corp) 28, Aug. 1992.

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