Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-10-05
2000-10-24
Sells, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156233, 156239, 156240, 156247, 156289, 427146, 427147, 428914, B44C 1165, B32B 3100, B41M 312, C09J 3100
Patent
active
061361275
ABSTRACT:
An electrically functional adhesive transfer for use in the manufacture and/or the design of flexible membrane circuits. Electrical circuit elements, instead of being printed directly upon polyester film substrates, are printed upon a carrier sheet. A pressure sensitive adhesive is applied over the exposed surfaces of the printed circuit pattern on the carrier sheet and covered by a release paper. The circuit later is applied to any desired substrate by peeling away the release paper and mounting the circuit by means of the pressure sensitive adhesive. The carrier sheet typically is peeled away after the circuit is adhesively bonded to the substrate. The carrier sheet desirably is transparent or translucent in order to facilitate visual alignment of the circuit pattern with the substrate to which it is being bonded.
REFERENCES:
patent: 4177309 (1979-12-01), Shadbolt et al.
patent: 4308310 (1981-12-01), Arnold et al.
patent: 4421816 (1983-12-01), Arnold
patent: 4786767 (1988-11-01), Kihlman
patent: 5049434 (1991-09-01), Wasulko
patent: 5061830 (1991-10-01), Ambrose
patent: 5239152 (1993-08-01), Caldwell et al.
patent: 5352315 (1994-10-01), Carrier et al.
patent: 5751256 (1998-05-01), McDonough et al.
Chartpak Inc.
Lorengo J. A.
Sells James
LandOfFree
Electrically conductive adhesive transfers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrically conductive adhesive transfers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrically conductive adhesive transfers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1959757