Electrically conductive adhesive compositions

Details Electrically conductive adhesive compositions Electrically conductive adhesive compositions

1993-06-16

1994-11-08

Zirker, Daniel R.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252514, 556 47, 556 60, 556142, 556144, 525 56, 525420, 525403, 525436, 525437, 525462, 525535, 522 66, 522126, 522146, 428355, 428352, C08F 250, C07F 1702

Patent

active

053624211

ABSTRACT:
An anisotropically conductive adhesive composition provides electrical conductivity between facing electrodes but maintains electric insulation laterally between adjacent electrodes and comprises (a) a cationically polymerizable monomer, such as a glycidyl epoxy resin; (b) a thermoplastic resin, essentially free of nucleophilic or metal complexing functional groups; (c) optionally, an alcohol containing material; (d) a thermally initiated catalyst system comprising: (1) a salt of an organometallic cation; (2) a cure rate enhancer; and (3) a stabilizing additive; (e) conductive particles; and (f) optionally, a silane coupling agent, wherein the adhesive compositions cure at a temperature of 120.degree.-125.degree. C.

REFERENCES:
patent: 4970624 (1990-11-01), Arneson et al.
patent: 5065505 (1991-11-01), Matsubara et al.
patent: 5245750 (1993-09-01), Crumly et al.

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