Electrically conducting connection

Details Electrically conducting connection Electrically conducting connection

1996-08-02

1998-03-24

Knight, Anthony

Joints and connections

Molded joint

Fusion bond, e.g., weld, etc.

403179, 65 591, 65 593, C04B 4190, C04B 3702, H01R 4302, H01R 402

Patent

active

057305439

DESCRIPTION:

BRIEF SUMMARY
The invention relates to an electrically conducting connection between a metal connector and a metal layer to which the connector is welded, said layer containing at least one metal and being mounted by a sintered connection on a ceramic substrate which preferably contains glass and/or glass ceramic in small quantities.
The type of connection described above has already been suggested for manufacturing.
However, such connections made in the laboratory have a number of disadvantages. Thus, the connection between the ceramic substrate and the metal, because of the very different properties of the materials of which the parts to be joined are made, especially their different coefficients of expansion and chemical compositions, is critical. Adhesion to the interface between the ceramic substrate on the one hand and the sintered metal layer on the other is extremely weak, firstly because the metal and ceramic form only a weak bond and secondly because the adhesion forces are very low. A sufficiently reliable connection cannot be ensured, particularly at high temperatures, and especially when mechanical stresses are added in addition, if welding is not performed on a sufficiently thick metal layer and/or a metallic connector, the metal layer and/or layers beneath, for example those of the ceramic substrate, are destroyed as a result, so that the electrical and/or mechanical system mounted on the ceramic substrate is no longer functional. In general, therefore, when producing the electrically conducting connection, either the reject rate is high or the electrical connection is not sufficiently mechanically stable and temperature-resistant.
The goal of the invention is to provide a connection as well as a method for the production of said connection that produce better and permanent connections.
In accordance with the teaching according to the invention, therefore, the metal layer is not applied directly to the ceramic substrate, but an adhesion-promoting layer is applied between these two layers, said adhesion-promoting layer containing glass and/or glass ceramic as well as metal particles in the form of flakes, powder, or the like to form a fused connection. A fused connection is produced between the glass and/or glass ceramic contained in the adhesion-promoting layer on the one hand and the glass components as well as the ceramic substrate or the latter alone on the other hand. Consequently, a positive connection is created between the ceramic substrate and the adhesion-promoting layer. At the same time, the metal particles of the adhesion-promoting layer join the glass components that melt or soften. As a result of this "flow," a positive connection is created between the various granular components and hence an intimate link results between the particles of the adhesion-promoting layer. Then the pure metal layer is applied to this adhesion-promoting layer, using thick-film technology for example, and joined to it by sintering. In this sintered connection, an intermetallic connection is formed between the metal particles of the metal layer and the metal particles in the adhesion-promoting layer. A mechanically strong bond with the adhesion-promoting layer is produced by a sintered connection. Then a metal connector in the form of a contact spring, contact clip, or metal foil is placed on the metal layer and is joined, especially advantageously because it takes place very quickly and with zero contact, by laser welding to form a good electrical connection with the metal layer that is mechanically extremely stable. When suitable high-temperature-resistant metals are used, noble metals such as platinum or their alloys for example, a high-temperature-resistant connection results that is a good electrical conductor and is mechanically extremely sturdy. It is especially suitable in highly oxidizing and corrosive environments at high temperature, in the hot and pulsating exhaust from internal combustion engines for example, as a connecting technique for gas sensors, lambda probes for example.
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