Electrically conducting adhesives for via fill applications

Metal fusion bonding – Process – Plural joints

Reexamination Certificate

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C228S248100

Reexamination Certificate

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07467742

ABSTRACT:
Electrically conducting adhesives having a broader selectable range of properties are provided by having random sizes of micrometer diameter range particles coated with a low melting temperature metal. The coated particles are suspended in a vehicle of a mixture of thermosetting resins together with a flux resin selected for viscosity and low shrinkage, for screen printability, for electrical and for mechanical properties over a broad range of specification conditions. The vehicle or resin system includes thermosetting cyclo-aliphatic epoxy, thermosetting phenoxy polymer and thermosetting mono-functional limonene oxide. The low temperature melting coating system for the particles includes In, Sn, and alloys such as In—Sn, Sn—Pb, Bi—Sn—In and InAg. The micrometer diameter range particles includes Cu, Ni, Co, Ag, Pd, Pt, polymer and ceramic.

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Kang et al, “Development of High Conductivity Lead (Pb)-Free Conducting Adhesives” IEEE Transactions on Conponents, Manufacturing Technology, Part A, vol. 21, No. 1, Mar. 1998, pp. 18-22.
Kang et al, “Development of Low Cost, Low Temperature Conductive Adhesives”, Proceedings of the 48thElectronic Components & Technology Conference, Seattle, Wash., May 1998, pp. 1031-1035.
Gonzalez et al, “Epoxy-Based Aqueous-Processable Photodilectric Dryfilm and Conductive Via Plus for PCB Buildup and IC Packaging,” Proc 48th Electronic Components Tech. Conf, Seattle. Wash, None 1998. p. 139-143.

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