Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-03-25
1994-07-19
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257700, 361794, H05K 720
Patent
active
053315111
ABSTRACT:
An encapsulated electrically and thermally enhanced integrated circuit is disclosed. An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate. A lead frame having inwardly-extending bonding fingers has the bottom sides thereof attached to the top of the substrate. A contiguous layer of insulating material is bonded to the top sides of the bonding fingers, such that the layer of insulating material peripherally surrounds the integrated-circuit die. A conductive layer of material is then bonded to the top of the insulating layer. A second layer of insulating material followed by a second conductive layer may be bonded on top of the first conductive layer. Electrical connections are made from the integrated-circuit die to the conductive layers surrounding the die. The device is then encapsulated in a plastic material.
REFERENCES:
patent: 4551747 (1985-11-01), Gilbert
patent: 4628407 (1986-12-01), August
patent: 4809135 (1989-02-01), Yerman
patent: 5191511 (1993-03-01), Sawaya
Lee Sang S.
Loh William M.
King Patrick T.
Tolin Gerald P.
VLSI Technology Inc.
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