Electrical to optical links using metalization

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

385 89, G02B 642

Patent

active

052281019

ABSTRACT:
An optical fiber mounted on a substrate and a semiconductor component mounted on a second substrate. The substrates abutting so that the component and fiber are optically aligned and the assembly is held in place by a first layer of adhesive which is then covered with an electroformed layer of metal to form a robust unit.

REFERENCES:
patent: 4170399 (1979-10-01), Hansen et al.
patent: 4610746 (1986-09-01), Broer et al.
patent: 4729623 (1988-03-01), Mery
patent: 5101464 (1992-03-01), Mousseaux et al.
Ladany et al., IEEE Photonics Technology Letters, vol. 3, No. 8, Aug. 1991, "Laser to Single-Mode Fiber Assembly Using an Electroforming Technique," pp. 749-751.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrical to optical links using metalization does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical to optical links using metalization, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical to optical links using metalization will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2318931

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.