Electrical terminal footprints for a printed circuit board

Details Electrical terminal footprints for a printed circuit board Electrical terminal footprints for a printed circuit board

2011-03-15

2011-03-15

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

07906734

ABSTRACT:
In one implementation, a PCB having an array of vias and electrical terminals disposed on the side of the PCB opposite the side configured to receive a grid array package are disclosed herein. The array of vias have pads and forms a pattern of repetitive rows and columns. A substantially consistent intervia distance is defined along an intervia axis between each adjacent via in each of the rows and columns. A pair of electrical terminals are positioned adjacent one another along an electrical terminal axis between at least two of the vias and the electrical terminal axis intersects the intervia axis. In another implementation, a group of four adjacent vias form a substantially rectangular shape having one of four vias positioned at each of four corners of the rectangular shape. One electrical terminal is positioned within the four vias without contacting any of the four vias.

REFERENCES:
patent: 6271481 (2001-08-01), Goenka et al.
patent: 6383603 (2002-05-01), Nojioka
patent: 2005/0162839 (2005-07-01), Chan et al.
patent: 2006/0166398 (2006-07-01), Chan
patent: 2007/0177364 (2007-08-01), Larsen et al.
patent: 2008/0205011 (2008-08-01), Chan et al.
patent: 2009/0014206 (2009-01-01), Motohashi et al.
Hisaki, Toshikuni, Shrinking Dimensions Typify Today's Multilayer Ceramic Capacitors, The American Enterprise Institute for Public Policy Research, AEI Press, Nov. 2005, 3 pages, Copyright 2005, Dempa Publications, Inc.
Taiyo Yuden, Products: Ceramic Capacitor Overview, 3 pages, Retrieved from website using Internet URL: <http:// www.t-yuden.com/capacitors/>, Copyright 1998-2004 Taiyo Yuden (U.S.A.), Inc.
Vishay Intertechnology, Inc., High Performance, High Precision Wire-Bondable 0402 Capacitor for Smartcard, High-Frequency and Substrate-Embedded Application, Product Specifications for HPC0402B/C, 3 pages, document No. 10120, revised Aug. 9, 2006.
Post, Andrew, Industry's Lowest-Profile (0.18 mm-height) 0402 Capacitors Introduced by Vishay, 2 pages, Oct. 25, 2002, Vishay Intertechnology, Inc. Press Release, Retrieved from website using Internet URL: <http://www.vishay.com/company/press/releases/2002/021025capacitors/?print>, Malvern Pennsylvania.
“PowerPC Embedded Processors Application Note—PowerPC 740/750: Power Notes,” IBM Microelectronics, Mar. 3, 1999, Version 1.1, 4 pages.
Brocade Communications Systems, Inc., screenshot of PBC assembly drawing dated Nov. 19, 2003 with enlarged images, 3 pages, publication date unknown.

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