Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...
Patent
1995-01-27
1999-11-16
Le, H. Thi
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Including a second component containing structurally defined...
174255, 1741262, 428405, 428421, 428422, 428461, 428901, 428325, B32B 516, H05K 103
Patent
active
RE0363960
ABSTRACT:
A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring board materials and circuit chip carriers. Also, the low coefficients of thermal expansion and compliant nature of this electrical substrate material results in improved surface mount reliability and plated through-hole reliability. The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material which renders the surface of the ceramic hydrophobic and provides improved tensile strength, peel strength and dimensional stability.
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Arthur David J.
Jackson Connie S.
Mosko John C.
Traut G. Robert
Le H. Thi
Rogers Corporation
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