Electrical substrate material

Details Electrical substrate material Electrical substrate material

1988-12-02

1992-09-22

Herbert, Jr., Thomas J.

Stock material or miscellaneous articles

Composite

Of fluorinated addition polymer from unsaturated monomers

428422, 428447, 428457, 428463, B32B 1508

Patent

active

051495902

ABSTRACT:
A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials is presented which exhibits improved electrical performance over other printed wiring board materials. Also, the low coefficients of thermal expansion and compliant nature of this electrical substrate material results in improved surface mount reliability and plated through-hole reliability. The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material which renders the surface of the ceramic hydrophobic and provides improved tensile strength, peel strenth and dimensional stability. In addition, even improved results are provided when the silane coating is comprised of a fluorinated silane or a combination of fluorinated and non-fluorinated silanes.

REFERENCES:
patent: 4036807 (1977-07-01), Atherton
patent: 4251432 (1981-02-01), Martin
patent: 4335180 (1982-06-01), Traut
patent: 4634631 (1987-01-01), Gazit et al.
patent: 4647508 (1987-03-01), Gazit et al.
patent: 4696851 (1987-09-01), Pryor
patent: 4705725 (1987-11-01), Glajch et al.
patent: 4847159 (1989-07-01), Glajch et al.
patent: 4849284 (1989-07-01), Arthur et al.

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