Electrical substrate material

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...

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428405, 428331, 428421, 428422, 428901, 428461, 174 685, B32B 516, B32B 1702, B32B 2720, H05K 100

Patent

active

048492841

ABSTRACT:
A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring board materials and circuit chip carriers. Also, the low coefficients of thermal expansion and compliant nature of this electrical substrate material results in improved surface mount reliability and plated through-hole reliability. The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material which renders the surface of the ceramic hydrophobic and provides improved tensile strength, peel strength and dimensional stability.

REFERENCES:
patent: 4036807 (1977-07-01), Atherton
patent: 4251432 (1981-02-01), Martin
patent: 4335180 (1982-06-01), Traut
patent: 4634631 (1987-01-01), Gazit et al.
patent: 4647508 (1987-03-01), Gazit et al.
patent: 4696851 (1987-09-01), Pryor

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