Electrical subassembly structure

Details Electrical subassembly structure Electrical subassembly structure

1985-01-07

1986-05-06

Abrams, Neil

Geometrical instruments

361414, H05K 114

Patent

active

045867640

ABSTRACT:
An electrical subassembly structure of two substrates has metalized portions located adjacent to the upper and lower edges on the back of each substrate. Clip on leads are attached to one substrate with a portion of each lead soldered to the lower edge metalized portion. The two substrates are electrically and mechanically joined by soldering upper edge metalized portions together and soldering the lower edge metalized portions of the other substrate to the lead portions.

REFERENCES:
patent: 3609464 (1971-09-01), Stone
patent: 3772776 (1973-10-01), Weisenburger
patent: 4107760 (1978-08-01), Zimmer
patent: 4250536 (1981-02-01), Barringer et al.
patent: 4339628 (1982-07-01), Marcantonio et al.
patent: 4423920 (1984-01-01), Cooper et al.
IBM Bulletin, Roche, vol. 5, No. 11, p. 14, 4-1963.

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