Electrical sub-assembly design for parallel optics modules

Details Electrical sub-assembly design for parallel optics modules Electrical sub-assembly design for parallel optics modules

2005-06-28

2005-06-28

Nguyen, Chau N. (Department: 2831)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S059000

Reexamination Certificate

active

06910809

ABSTRACT:
A device includes a printed circuit board, a first photoactive array, a second photoactive array, a first driver chip, a second driver chip, a first connector, and a second connector. The printed circuit board includes a mounting surface section, a first flex circuit, a second flex circuit, a first rigid section, and a second rigid section. The first and second flex circuits are oriented substantially ninety degrees to the mounting surface section. The first rigid section is oriented substantially ninety degrees to the first flex circuit, and the second rigid section is oriented substantially ninety degrees to the second flex circuit. The first rigid section and the second rigid section lie substantially in the same plane. The first and second photoactive arrays, and the first and second driver chips are mounted on the mounting surface section.

REFERENCES:
patent: 5445608 (1995-08-01), Chen et al.
patent: 5655290 (1997-08-01), Moresco et al.
patent: 6676302 (2004-01-01), Cheng et al.
patent: 2003/0044157 (2003-03-01), Wickman et al.
U.S. patent application Ser. No. 60/334,679, filed Nov. 15, 2001.

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