Electrical solder and method of manufacturing

Details Electrical solder and method of manufacturing Electrical solder and method of manufacturing

1997-03-28

1999-07-27

Wyszomierski, George

Specialized metallurgical processes, compositions for use therei

Compositions

Loose particulate mixture containing metal particles

420562, 148 26, C22C 1300

Patent

active

059284048

ABSTRACT:
A method of manufacturing an electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary powder is the same as is used in conventional solder paste. The additive powder has a melting point substantially higher than the melting point of the primary powder. The primary powder comprises between 60-99% Sn, 0-40% Pb and 0-10% Ag. The additive powder metal is selected from the metal group comprising Sn, Pb, Ni, Cu, Ag, and Bi and mixtures thereof.

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