Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-06-21
2005-06-21
Duverne, J. F. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
06908313
ABSTRACT:
An electrical socket for interconnecting an LGA chip with a PCB includes an insulative housing (2) and a multiplicity of terminals (1). The housing includes a plurality of passageways (26) extending therethrough for engagingly accommodating corresponding terminals. Each terminal includes a locating plate (10) arranged in rows, and a mating beam (12) connected to the locating plate and extending along the corresponding row. The terminals and the mating beams are arranged so that a projection A of each mating beam along the corresponding row is longer than a distance B between each two adjacent locating plates of two adjacent terminals arranged in the same row. Accordingly, when the mating beams are engaged with electrodes of the LGA chip, the mating beams are long enough to provide excellent resilient deflection characteristics, thereby ensuring good mechanical and electrical connection between the mating beams and the electrodes.
REFERENCES:
patent: 4715820 (1987-12-01), Andrews et al.
patent: 6139377 (2000-10-01), Chen
patent: 6171134 (2001-01-01), Lai
patent: 6186797 (2001-02-01), Wang et al.
patent: 6193554 (2001-02-01), Wu
patent: 6203335 (2001-03-01), Chang
patent: 6217388 (2001-04-01), Francis
patent: 6805561 (2004-10-01), Walkup et al.
Liao Fang-Jwu
Walkup William B.
Chung Wei Te
Duverne J. F.
Hon Hai - Precision Ind. Co., Ltd.
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