Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1990-01-12
1990-11-13
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 73, 439248, 439493, H01R 909
Patent
active
049698281
ABSTRACT:
An electrical socket for TAB ICs. More particularly, the socket includes a flexible etched film having an array of traces thereon, a base on which the film is positioned to receive a TAB IC thereover and a cover having a pressure plate for biasing the IC against the film to provide an electrical connection between respective traces on the IC and on the film.
REFERENCES:
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patent: 4411719 (1983-10-01), Lindberg
patent: 4453795 (1984-06-01), Moulin
patent: 4560216 (1985-12-01), Egawa
patent: 4696526 (1987-09-01), Newton et al.
patent: 4713611 (1987-12-01), Solstad et al.
patent: 4758176 (1988-07-01), Abe et al.
patent: 4772936 (1988-09-01), Reding et al.
patent: 4783719 (1988-11-01), Jamison et al.
IBM Technical Disclosure Bulletin "Film Supported Probe for the AC Pulse Testing of Integrated Circuits", vol. 10, Mar. 1968.
Bright Edward J.
Consoli John J.
Taylor Attalee S.
AMP Incorporated
Bradley Paula A.
Osborne Allan B.
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