Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Patent
1989-08-07
1990-12-18
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
439 84, 439858, 439885, H01R 909
Patent
active
049783076
ABSTRACT:
An electrical socket for substrates and particularly ceramic substrates. More particularly, the socket includes a U-shaped receptacle and a mounting section for attaching the receptacle to the substrate. The mounting section is attached to one leg of the receptacle and includes a solder foot for being soldered to a circuit pad on the substrate.
REFERENCES:
patent: 2782389 (1957-02-01), Sunko et al.
patent: 2882512 (1959-04-01), Morone, Jr.
patent: 3340440 (1967-09-01), Minter
patent: 3781770 (1973-12-01), Mancini
patent: 3803537 (1974-04-01), Cobaugh et al.
patent: 4245876 (1981-01-01), Ritchie et al.
patent: 4270829 (1981-06-01), Wilson
patent: 4436358 (1984-03-01), Coldren et al.
patent: 4498725 (1985-02-01), Bright et al.
patent: 4592617 (1986-06-01), Seidler
patent: 4695106 (1987-09-01), Feldman et al.
patent: 4726793 (1988-02-01), Bright
Billman Timothy B.
Taylor Attalee S.
Abrams Neil
AMP Incorporated
Nguyen Khiem
Osborne Allan B.
LandOfFree
Electrical socket for substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrical socket for substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical socket for substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1423211