Electrical socket for leadless integrated circuit packages

Details Electrical socket for leadless integrated circuit packages Electrical socket for leadless integrated circuit packages

1981-07-06

1983-07-26

McQuade, John

Geometrical instruments

29884, 339 17CF, 339176MP, H01R 2372

Patent

active

043950841

ABSTRACT:
A frame type electrical socket for connecting leadless integrated circuit packages to a printed circuit board is disclosed. The socket includes a rectangular frame member and four contact assemblies. Each contact assembly is designed to detachably mate with each side of the frame. The contact assemblies include molded-in-place contacts which are shaped to provide pressure contacts after they are molded in place. Prior to molding, the contacts are in the form of flat ribbons, allowing them to be constructed in the form of a lead frame. The socket possesses all of the features of molded-in-place contacts as well as having the advantage of being able to replace damaged contacts without discarding the frame.

REFERENCES:
patent: 3026494 (1962-03-01), Andersen et al.
patent: 3877064 (1975-04-01), Scheingold et al.
patent: 3904262 (1975-09-01), Cutchaw
patent: 3940786 (1976-02-01), Scheingold et al.
patent: 3951491 (1976-04-01), Mysiak
patent: 3982159 (1976-09-01), Dennis et al.
patent: 4008938 (1977-02-01), Anhalt et al.
patent: 4063791 (1977-12-01), Cutchaw
patent: 4340266 (1982-07-01), Grovender

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