Surgery – Diagnostic testing – Structure of body-contacting electrode or electrode inserted...
Reexamination Certificate
2006-09-05
2006-09-05
Cohen, Lee S. (Department: 3739)
Surgery
Diagnostic testing
Structure of body-contacting electrode or electrode inserted...
C607S115000, C607S148000, C029S825000
Reexamination Certificate
active
07103398
ABSTRACT:
The electrical signal sensing and/or signal application device for sensing electrical signals on a surface and/or for applying electrical signals to a surface, particularly of human or animal skin or other organs or tissues, comprises a substrate (12) having first and second major surfaces (14), and a plurality of electrodes (16) arranged on the first major surface (14) of the substrate (12) and projecting therefrom, each of the electrodes (16) comprising a pointed contact end (36) facing away from the substrate (12) for contacting the surface, and a base end (26) facing towards the substrate (12). On the first or second or both major surfaces (14) of the substrate (12) there is arranged a plurality of first contact pads (22) for electrical connection to contact elements of an evaluation and/or driving means for evaluating the sensed electric signals and/or applying signals to the electrodes (16), the first contact pads (22) being electrically connected to the electrodes (16). The first major surface (14) of the substrate (12) comprises, for each electrode (16), a second contact pad (18) the base ends (26) of the electrodes electrically and mechanically connected to the second contact pads (18). Each electrode (18) is generated by bonding an electrically conductive bonding wire to a second contact pad (18) for generating a thickened socket portion (24) of the electrode comprising its base end (26), and by tearing the bonded bonding wire off the socket portion (24) so as to generate a pointed portion (34) of the electrode (16) comprising its pointed contact end (36) and projecting from the socket portion (24) thereof.
REFERENCES:
patent: 3490439 (1970-01-01), Rolston
patent: 3896790 (1975-07-01), Dikmen
patent: 4353372 (1982-10-01), Ayer
patent: 4926879 (1990-05-01), Sevrain et al.
patent: 4969468 (1990-11-01), Byers et al.
patent: 5143079 (1992-09-01), Frei et al.
patent: 5184620 (1993-02-01), Cudahy et al.
patent: 5215088 (1993-06-01), Normann et al.
patent: 5361760 (1994-11-01), Normann et al.
patent: 5452718 (1995-09-01), Clare et al.
patent: 5482038 (1996-01-01), Ruff
patent: 5509822 (1996-04-01), Negus et al.
patent: 5810742 (1998-09-01), Pearlman
patent: 5928159 (1999-07-01), Eggers et al.
patent: 5928458 (1999-07-01), Aschenbrenner et al.
patent: 6055448 (2000-04-01), Anderson et al.
patent: 6128521 (2000-10-01), Marro et al.
patent: 6745062 (2004-06-01), Finneran et al.
patent: U 8502291 (1985-06-01), None
patent: U 9218879 (1996-03-01), None
patent: 0 538 739 (1994-12-01), None
patent: 0 533 487 (1996-03-01), None
patent: WO 87/07825 (1987-12-01), None
patent: WO 97/47235 (1997-12-01), None
patent: WO 98/09155 (1998-03-01), None
M. Klein, et al., “Single Chip Bumping”, Technical University of Berlin, Center of Microperipheric Technologies, Berlin, Germany, and Fraunhofer Institute for Reliability and Microintegration IZM Berlin, Germany. Paper consists 6 pgs. (Publication date not known, but is before the priority date of the present application.).
R. Aschenbrenner, et al., “Flip Chip Attachment Using Non-Conductive Adhesives and Gold Ball Bumps”, Paper presented to International Electronics Packaging Conference, Altanta, Georgia, Sep. 25-28, 1994. Paper consists 14 pages.
J. Eldring, et al., “Flip Chip Attachment using Mechanical Bumps”, Paper published by Semiconductor Technology Center, Inc., 1994, ITAP & Flip Chip Proceedings, pp. 74-81.
TransScan Research and Development Co., Ltd., Product Data and Brochure with review by Food and Drug Administration, Apr. 16, 1999. Found at http://www.imaginis.com/t-scan/references.asp?mode=1.
A. J. Bruce, et al., “Overview of Skin Cancer Detection and Prevention for the Primary Care Physician”, Mayo Clinic Proc., Mayo Foundation for Medical Education and Research, May 2000; vol. 75: pp. 491-500.
3M Innovative Properties Company
Cohen Lee S.
Gover Melanie G.
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