Electrical property altering, planar member with solder...

Details Electrical property altering, planar member with solder... Electrical property altering, planar member with solder...

2009-06-25

2011-10-25

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S779000, C257S780000, C257S781000, C257SE23021, C257SE23068, C257SE23069

Reexamination Certificate

active

08044512

ABSTRACT:
A structure includes a solder element for electrically coupling a substrate of an integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and at least one of a landing pad of the substrate and a landing pad of the PCB. In another embodiment, the electrical property altering, planar member can be applied to the solder element(s) between the IC chip and the package substrate.

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