Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-03-08
2001-09-18
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S717000, C361S767000, C257S701000, C257S703000, C165S080300
Reexamination Certificate
active
06292368
ABSTRACT:
The present invention relates to electrical power components, such as transistors, which are mounted on a printed circuit board or the like. They are used, for example, in the field of automobiles for engine control or even to produce power converters.
The mounting, on a given printed circuit, of a power component and other electrical components which must be connected thereto aims to facilitate the task of establishing appropriate connections.
This task, however, necessitates several operations because a power component has two active faces, one with a single electrode such as a transistor collector or diode electrode and the other face comprising the other diode electrode or the other electrodes of the transistor.
When connecting the electrodes of these two faces electrically to the other components, the tracks of the printed circuit permit direct connection of only the electrode or electrodes of one of the faces, which is placed against the printed circuit. Furthermore, since a power component is involved, high currents pass through it and this necessitates connections with a large cross section. Furthermore, it is necessary to be able to dissipate the heat produced by his power component
The present invention aims to facilitate the mounting of such an electrical power component on an electrical connection support
To this end, the invention firstly relates to an electrical power component provided with electrodes including, on one of the faces of the component, a single electrode, the electrodes being arranged to be connected by brazing to an electrical connection support, the said single electrode being arranged to be connected to the support by means of an electrical and thermal connection plate.
Thus by a single brazing operation it is possible to connect the electrodes of the two faces of the component to the support electrically, while at the same time ensuring mechanical attachment of the component to this support as well as low electrical and thermal resistances with respect thereto by reason of the fact that a plate has a cross-section considerably larger than a simple wire.
Components are indeed known, but of low power, having a single active face, to be brazed onto a printed circuit in order to attach them thereto by an inactive face on the underside, opposite the active face on the upper side, and in order then to connect the electrodes of the active face electrically to the printed circuit by wires which are brazed one by one.
Another known solution for connecting such low-power components to the printed circuit consists of producing brazing protuberances on the electrodes of the active face and placing this active face on the circuit in order thus to connect it thereto mechanically and electrically.
These two previous arts, with a single active face, did not permit the solution of the invention to be achieved.
The invention also relates to a board of electrical components including a power component of the invention, with receiving areas connected by brazing to the electrodes of the power component, to the said single electrode by means of an electrical and thermal connection plate.
Finally, the invention relates to a process for mounting, on an electrical connection support, an electrical power component provided with electrodes including, on one of the faces of the component, a single electrode, the process being characterised in that the component is placed on the support and the electrodes are placed facing brazing areas of the support connected to conductive tracks, at least one plate is placed on the face with the single electrode of the component, with a layer of brazing product being interposed, and the board is passed into a brazing furnace in order to connect all its electrodes collectively to the receiving areas and to change the plate into an electrical and thermal connection plate.
The establishment of all the connections is thus carried out in an overall manner in a single step.
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Datskovsky Michael
Picard Leo P.
Quarles & Brady LLP
Sagem SA
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