Electrical package for LSI devices and assembly process therefor

Details Electrical package for LSI devices and assembly process therefor Electrical package for LSI devices and assembly process therefor

1974-12-20

1978-02-14

Smith, Jr., David

Electricity: electrical systems and devices

Miscellaneous

H05K 104

Patent

active

040743420

ABSTRACT:
An electrical package for Large Scale Integrated (LSI) devices includes a carrier having (a) thermal expansion similar to a semiconductor, (b) a standard array of terminal pins (100 or more) and (c) a circuit transposer that is (i) a semiconductor material, typically silicon and (ii) readily personalized to connect any combination of attached LSI devices to the input-output terminal pins. The package utilizes solder technology to interconnect the carrier, circuit transposer and LSI devices. The carrier and semiconductor transposer eliminate mechanical stress on the solder joints that would otherwise occur from thermal coefficient expansion (TCE) mismatch between dissimilar package materials. The circuit transposer increases the wirability of electrical packages utilizing solder technology. Reliability problems presented by thick film paste or metallized conductors on carriers are also overcome by the semiconductor circuit transposer. The package may be fabricated by commercially acceptable processes that are automatable.

REFERENCES:
patent: 3323022 (1967-05-01), DaCosta
patent: 3437883 (1969-04-01), Smith
patent: 3577037 (1971-05-01), DiPietro et al.
patent: 3604989 (1971-09-01), Haneta et al.
patent: 3648131 (1972-03-01), Stuby
patent: 3777220 (1973-12-01), Tatusko et al.
patent: 3952231 (1976-04-01), Davidson et al.

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