Electrical overstress materials and method of manufacture

Compositions – Electrically conductive or emissive compositions – Metal compound containing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

252515, 252521, 338 21, 338 22R, 338225D, 425327, 425329, H01B 100, H01B 114, H01B 120

Patent

active

052943747

ABSTRACT:
This invention provides a method of preparing an electrical overstress material having a nonlinear resistance which declines sharply in response to an electric field exceeding a clamping voltage so as to be able to shunt out transient surges which method comprises using an adhesive binder, for example a silicone rubber or a ceramics dispersion, and thorough mixing therein of small conductive, and optionally semiconductive particles, for example nickel particles of various morphologies and silicon carbide particles respectively, followed by molding under pressure and curing. The invention is also directed to the electrical overstress material itself which has excellent strength and integrity as well as survivability from multiple surges and has multiple applications in, for example, electrical outlet strips and power cables. The invention is also directed to a power outlet strip comprising a plurality of surge arresting elements composed of the electrical overstress material of the invention.

REFERENCES:
patent: 2796505 (1957-06-01), Bocciarelli
patent: 2952761 (1960-09-01), Smith-Johannsen
patent: 2978665 (1961-04-01), Vernet et al.
patent: 3210460 (1965-10-01), Suelmann
patent: 3210461 (1965-10-01), Berg et al.
patent: 3412200 (1968-11-01), Virsberg
patent: 3576387 (1971-04-01), Derby
patent: 3682841 (1972-08-01), Matsuoka et al.
patent: 3687871 (1972-08-01), Masuyama et al.
patent: 3849333 (1974-11-01), Lloyd et al.
patent: 3859569 (1975-01-01), Kresge
patent: 3863193 (1975-01-01), Matsuura et al.
patent: 3896480 (1975-07-01), Harnden, Jr.
patent: 3900432 (1975-08-01), Marcus et al.
patent: 3936396 (1976-02-01), Masuyama et al.
patent: 3938725 (1976-02-01), Hardwick et al.
patent: 3950604 (1976-04-01), Penneck
patent: 3954419 (1976-05-01), Kaufman et al.
patent: 4011360 (1977-03-01), Walsh
patent: 4032965 (1977-06-01), Cline et al.
patent: 4097834 (1978-06-01), Mar et al.
patent: 4103274 (1978-07-01), Burgess et al.
patent: 4127511 (1978-11-01), Klein et al.
patent: 4146677 (1979-03-01), Merz et al.
patent: 4163204 (1979-07-01), Sado et al.
patent: 4166159 (1979-08-01), Pober
patent: 4172922 (1979-10-01), Merz et al.
patent: 4174530 (1979-11-01), Kregge et al.
patent: 4184984 (1980-01-01), Levinson
patent: 4205298 (1980-05-01), Shapiro et al.
patent: 4207482 (1980-06-01), Neumeyer et al.
patent: 4219862 (1980-08-01), Nitta et al.
patent: 4234902 (1980-11-01), Fujiwara et al.
patent: 4252692 (1981-02-01), Taylor et al.
patent: 4278961 (1981-07-01), Schroeder et al.
patent: 4290041 (1981-09-01), Utsumi et al.
patent: 4306214 (1981-12-01), Miyabayashi et al.
patent: 4316171 (1982-02-01), Miyabayashi et al.
patent: 4320436 (1982-03-01), Bushnell
patent: 4331948 (1982-06-01), Malinaric et al.
patent: 4333861 (1982-06-01), Aoki et al.
patent: 4338223 (1982-07-01), Yokomizo et al.
patent: 4347505 (1982-08-01), Anderson
patent: 4364021 (1982-12-01), Levinson
patent: 4383237 (1983-05-01), Eda et al.
patent: 4397773 (1983-08-01), May
patent: 4397775 (1983-08-01), Levinson
patent: 4420737 (1983-12-01), Miyoshi et al.
patent: 4430255 (1984-02-01), Yan
patent: 4431861 (1984-02-01), Clabburn et al.
patent: 4438158 (1984-03-01), Eichelberger et al.
patent: 4438214 (1984-03-01), Masuyama et al.
patent: 4439807 (1984-03-01), Reitz
patent: 4444351 (1984-04-01), Dries et al.
patent: 4450426 (1984-05-01), Miyoshi et al.
patent: 4452728 (1984-06-01), Carlson et al.
patent: 4452729 (1984-06-01), Carlson et al.
patent: 4460497 (1984-07-01), Gupta et al.
patent: 4460623 (1984-07-01), Levinson
patent: 4463268 (1984-07-01), Levinson
patent: 4470898 (1984-09-01), Penneck et al.
patent: 4472239 (1984-09-01), Johnson et al.
patent: 4473765 (1984-09-01), Butman, Jr. et al.
patent: 4473812 (1984-09-01), Maruyama et al.
patent: 4490318 (1984-12-01), Masuyama et al.
patent: 4497533 (1985-02-01), Genova et al.
patent: 4507359 (1985-03-01), Powers, Jr.
patent: 4510112 (1985-04-01), Lauf
patent: 4519942 (1985-05-01), Yamaoka et al.
patent: 4540604 (1985-09-01), Siuta
patent: 4541974 (1985-09-01), Yamaoka et al.
patent: 4545929 (1985-10-01), Masuyama et al.
patent: 4547314 (1985-10-01), Masuyama et al.
patent: 4549981 (1985-10-01), Gupta et al.
patent: 4575440 (1986-03-01), Palilla
patent: 4579702 (1986-04-01), Maruyama et al.
patent: 4581621 (1986-04-01), Reed
patent: 4586074 (1986-04-01), Stapelbroek et al.
patent: 4613645 (1986-09-01), Robeson et al.
patent: 4624137 (1986-11-01), Johnson et al.
patent: 4624990 (1986-11-01), Lunk et al.
patent: 4726991 (1988-02-01), Hyatt et al.
patent: 4977357 (1990-12-01), Shrier
patent: 4992333 (1991-03-01), Hyatt

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrical overstress materials and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical overstress materials and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical overstress materials and method of manufacture will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1534218

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.