Electrical module assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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174 35R, 174252, 257713, 361799, 361800, 361820, H05K 720

Patent

active

053674340

ABSTRACT:
An electrical module assembly (100) includes a mounting frame (130) having a passage (135) extending though the mounting frame (130). A heat sink (160) is positioned within the passage (135) of the mounting frame (130). A module substrate (120) is located on or near the heat sink (160) such that there is thermal conductivity between the module substrate (120) and the heat sink (160). A heat-generating semiconductor device (122), such as a power amplifier (122), which requires heat dissipation, is positioned on the module substrate (120) such that there is thermal conductivity between the heat-generating semiconductor device and the heat sink (160). Electrical connection to the module substrate (120) is provided through the mounting frame (130).

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patent: 5198887 (1993-03-01), Brown
Hermetic Hybrid Module, Martin, IBM Tech Discl Bull vol. 21 No. 10 Mar. 1979, pp. 4023, 4024.

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