Electrical microfilament to circuit interface

Details Electrical microfilament to circuit interface Electrical microfilament to circuit interface

2006-12-11

2009-12-01

Nguyen, Dao H (Department: 2818)

Electricity: conductors and insulators

Conduits, cables or conductors

Conductor structure

C174S128200, C174S1130AS, C174S13100R, C174S254000, C257S666000, C257S678000, C257S686000, C257SE23067, C257SE23079

Reexamination Certificate

active

07626123

ABSTRACT:
Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.

REFERENCES:
patent: 3337838 (1967-08-01), Damiano et al.
patent: 3601759 (1971-08-01), Barker
patent: 4132461 (1979-01-01), Jaques
patent: 4203650 (1980-05-01), Millet et al.
patent: 4369104 (1983-01-01), Beckley
patent: 5599615 (1997-02-01), Swift et al.
patent: 5610747 (1997-03-01), Jacobsen
patent: 5861662 (1999-01-01), Candelore
patent: 6020747 (2000-02-01), Bahns et al.
patent: 6110354 (2000-08-01), Sayan et al.
patent: 6128527 (2000-10-01), Howard, III et al.
patent: 6289187 (2001-09-01), Swift et al.
patent: 6330466 (2001-12-01), Hofmann et al.
patent: 6334856 (2002-01-01), Allen et al.
patent: 6444102 (2002-09-01), Tucci et al.
patent: 6462398 (2002-10-01), Jojiki
patent: 6515346 (2003-02-01), Kemeny
patent: 6740214 (2004-05-01), Dobson et al.
patent: 6794984 (2004-09-01), Koatsu
patent: 6829498 (2004-12-01), Kipke et al.
patent: 6851980 (2005-02-01), Nelson et al.
patent: 6892438 (2005-05-01), Hill et al.
patent: 6924439 (2005-08-01), Bonni et al.
patent: 6946851 (2005-09-01), Lee et al.
patent: 6953347 (2005-10-01), McGrath et al.
patent: 6993392 (2006-01-01), Nicolelis et al.
patent: 7010356 (2006-03-01), Jog et al.
patent: 7333699 (2008-02-01), Jacobsen et al.
patent: 7550677 (2009-06-01), Debladis et al.
patent: 2004/0080056 (2004-04-01), Lim et al.
patent: 2004/0125515 (2004-07-01), Popovich
patent: 2005/0029009 (2005-02-01), Swift
patent: 2005/0029646 (2005-02-01), Ueda et al.
patent: 2005/0143790 (2005-06-01), Kipke
patent: 2005/0159028 (2005-07-01), Sweetland
patent: 2005/0202695 (2005-09-01), Sweetland
patent: 2005/0230795 (2005-10-01), Furuyama et al.
patent: 2006/0039660 (2006-02-01), Henze
patent: 2007/0142714 (2007-06-01), Shumate
patent: 2039421 (1980-08-01), None
patent: 2004237077 (2004-08-01), None
Brunsting et al. “Enhanced optical performance for small form factor LC connectors”: Panduit Corp., pp. 1-5.
Hayes, Jim “Connector types and terminology”: Power and Integrated Building Systems, Editorial, pp. 1-2, 2005.
Allan, “Twist-pin concept increases miniature connector reliability” Electronic Design, The authority on emerging technologies for desing solutions freescale.com pp. 1-2, 2002.
Bell, “Carpenter breaks barrier with nano-miniature connector specification”, Mar. 9, 2005, pp. 1-3. Columbus Federal Voice.
Z-Axis Connector Company “Miniature Electronic Connectors”: pp. 1-11.
Glenair “MIL-DTL-32139 Nanominiature Connectors Single row metal shell pigtails (M32139.01 & 02)”: www.glenair.com, 2005, pp. 1-2.
Nano Line—NJS Microminiature, ITT Industries, www.ittcannon.com, p. L-14.
Nano Line—Strip-NT Microminiature, ITT Industries, www.ittcannon.com, p. L-15.
Patterson, William et al. “A microelectrode/microelectronic hybrid device for for brain implantable neuroprosthesis applications”: IEEE, Oct. 2004, pp. 1845-1853, vol. 51, No. 10.
Normann, “Sight restoration for individuals with profound blindness”, www.bioen.utah.edu/cni/projects/blindess.htm, Sep. 21, 2005, pp. 1-21.
Jacobsen, U.S. Appl. No. 12/070,580, filed Feb. 19, 2008.
Jacobsen, U.S. Appl. No. 11/637,508, filed Dec. 11, 2006.
“LSI Announces Wire-Bond Advance” pp. 1-2.
Brunner et at., “Advanced wire bond looping technology for emerging packages”, SEMI Technical Symposium; Innovations in Semiconductor Manufacturing, 2004, pp. 1-8.
Karnezos et al. 3D Packaging Promises Perfomance, reliabilyt Gains with Small Footprints and Lower Porfiles, www.cipscalereview.com, Feb. 2005, pp. 1-6.
Chylak et al. “Overcoing the key barriers in 35 umPitch wire bond packaging: probe, mold, and substrate solutions and trade-offs” SEMI/IEEE, 2002, pp. 1-6.
ESEC “25um fine pitch solution”, 2002, pp. 1-3.
ASE Kaohsiung, “CSP Leadless LGA”, pp. 1-5, 2005.

Affiliated with

Also associated with

Rating

Electrical microfilament to circuit interface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical microfilament to circuit interface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical microfilament to circuit interface will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4081287