Electrical means for extracting layer to layer registration

Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating resistive material

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216 61, 216 86, 216 33, B44C 122

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058634460

ABSTRACT:
A method for determining a fiducial misregistration of conductive layers of a laminated substrate by providing a plurality of alternatingly disposed dielectric layers and conductive layers. A predetermined area of resistive material is formed as part of at least one conductive layer. Each predetermined area of resistive material is formed at a same corresponding location in each respective conductive layer, and each predetermined area of resistive material has a first end and a second end. A through-via is formed and connected to each predetermined area of resistive material between the first and second ends of each respective predetermined area. A total resistance is determined between the first end and the second end of each predetermined area of resistive material. A first fractional resistance is determined between the first end of each predetermined area of resistive material and the through-via. A second fractional resistance is determined between the second end of each predetermined area of resistive material and the through-via. A fiducial misregistration of each conductive layer with respect to a location of the through-via is determined based on the respective first and second fractional resistances and the respective total resistance for each predetermined area of resistive material.

REFERENCES:
patent: 3095340 (1963-06-01), Triller
patent: 3788911 (1974-01-01), Unger
patent: 3953556 (1976-04-01), Gore
patent: 4348253 (1982-09-01), Subbarao et al.
patent: 4445978 (1984-05-01), Whartenby et al.
patent: 4473737 (1984-09-01), Anthony
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4547836 (1985-10-01), Anthony
patent: 4595428 (1986-06-01), Anthony et al.
patent: 4647476 (1987-03-01), Anthony
patent: 4705762 (1987-11-01), Ota et al.
patent: 4720308 (1988-01-01), Anthony et al.
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 4913656 (1990-04-01), Gordon et al.
patent: 4943032 (1990-07-01), Zdeblick
patent: 4959119 (1990-09-01), Lantzer
patent: 4985296 (1991-01-01), Mortimer, Jr.
patent: 5009607 (1991-04-01), Gordon et al.
patent: 5019997 (1991-05-01), Haller
patent: 5071359 (1991-12-01), Arnio et al.
patent: 5108785 (1992-04-01), Lincoln et al.
patent: 5171964 (1992-12-01), Booke et al.
patent: 5224265 (1993-07-01), Dux et al.
patent: 5227012 (1993-07-01), Brandli et al.
patent: 5245751 (1993-09-01), Locke et al.
patent: 5251097 (1993-10-01), Simmons et al.
patent: 5293025 (1994-03-01), Wang
patent: 5293626 (1994-03-01), Priest et al.
patent: 5331203 (1994-07-01), Wojnarowski et al.
patent: 5355397 (1994-10-01), Hanson et al.
patent: 5377404 (1995-01-01), Berg
patent: 5378313 (1995-01-01), Pace
patent: 5378318 (1995-01-01), Weling et al.
patent: 5391516 (1995-02-01), Wojnarowski et al.
patent: 5428803 (1995-06-01), Chen et al.
patent: 5442475 (1995-08-01), Bausman et al.
patent: 5459634 (1995-10-01), Nelson et al.
patent: 5466892 (1995-11-01), Howard et al.
patent: 5509553 (1996-04-01), Hunter, Jr. et al.
patent: 5541367 (1996-07-01), Swamy
patent: 5541731 (1996-07-01), Freedenberg et al.
Article, Lizotte et al., "Laser drilling speeds BGA packaging", Solid State Technology, Sep. 1996, pp. 120-128.
Article, Eskew et al., "Laser drill and patterning system for low cost, rapid prototyping", ICEMCM '95, pp. 314-319.
Brochure, "Impact--Laser Processing Systems", Lumonics Corporation, 4 pages.
Article, Tourne, "Laser Via Technologies for High Density MCM-L Fabrication", ICEMCM '95, pp. 71-76.
Article, Cary, "MCM-L Substrates for a 300 MHZ Workstation", ICEMCM '95, pp. 537-542.
Article, Patel et al., "Projection Laser Ablation Mask Alternatives", ICEMCM '95, pp. 32-326.
Technical Paper, Kosto et al., "Low Cost Through-Hole Activation Method for PTFE Based Substrates", IPC, pp. P6-5-1 through P6-5-8.
Article, Jain et al., "Large-Area, High Throughput, High-Resolution Patternmaking and Via-Drilling System", ICEMCM '95, pp. 327-335.
Article, Lemke, "Recent Developments in the Production and Application of Advanced Laminate Based MCMs and Chip Carriers", ICEMCM '95, pp. 235-240.
Article, Freda et al. "Laminate Based Substrates in Semiconductor Packages", ICEMCM '95, pp. 559-566.

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