Electrical lead for surface mounting of substrates

Details Electrical lead for surface mounting of substrates Electrical lead for surface mounting of substrates

1994-04-06

1995-08-15

Desmond, Eugene F.

Electrical connectors

Metallic connector or contact having part permanently...

Adapted to be secured to conductor formed on printed circuit...

H01R 402

Patent

active

054414300

ABSTRACT:
A clip lead is provided for soldering to and supporting a first substrate vertically on a second substrate which may be horizontal. The terminal end of the clip is configured to form a stable support for the substrate during soldering in a vertical position to the second substrate by being bent at right angles to and extending under the first substrate.

REFERENCES:
patent: 4085998 (1978-04-01), Owens
patent: 5246391 (1993-09-01), Seidler

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