Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2007-10-10
2009-06-23
Sefer, A. (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S778000, C257SE21577
Reexamination Certificate
active
07550853
ABSTRACT:
A monolithic electronic chip including: a substrate; a first circuit formed on a first circuit portion of the substrate; a second circuit formed on a second circuit portion of the substrate; and at least one conductive impedance tap formed a through-hole in the substrate. The substrate includes first and second opposing surfaces and at least one through-hole extending from the first surface to the second surface. Each of the circuit portions is disposed on one or both of the opposing surfaces. Each conductive impedance tap is coupled to the surface of the through-hole it is formed in to electrically couple the substrate to a reference voltage. The impedance between each circuit and the reference voltage via the conductive impedance tap(s) is less than the crosstalk impedance between the first circuit and the second circuit via the substrate.
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ITT Manufacturing Enterprises Inc.
Nguyen Dilinh P
Ratner & Prestia
Sefer A.
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